Market Summary
Global 3D IC Market Overview:
3D IC Market Size was valued at USD 9.6 Billion in 2023. The 3D IC market industry is projected to grow from USD 11.52 Billion in 2024 to USD 41.5 Billion by 2032, exhibiting a compound annual growth rate (CAGR) of 17.36% during the forecast period (2024 - 2032). Increased demand for advanced electronic products and high demand for 3D packaging using TSVs are the key market drivers enhancing the market growth.
Source: Secondary Research, Primary Research, MRFR Database and Analyst Review
3D IC Market Trends
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Growing demand for advanced electronic products is driving the market growth.
Market CAGR for 3D IC is driven by the rising demand for advanced electronic products. Developing smart cars, industrial gear, and infrastructure brings the significant potential to the 3D IC market. The widespread use of smartphones and other wearable technology worldwide is another feature defining the dynamic integrated circuit market environment. The market value for 3D integrated circuits will also increase due to the increasing demand from the ICT sector.
In addition, the market is developing due to the rising demand for integrated circuits and improved electronics architecture with low power consumption characteristics. This is further helped by the new trend of IC integration and wafer-level packaging in sensors and other miniaturized electronic devices. Further aiding market expansion is the widespread use of 3D IC smart home appliances such as security locks, thermostats, fan controls, smart smoke alarms, window sensors, and energy monitors. They are also included in many medical devices, including tiny heart monitors, sight and hearing aids, and other medical equipment. Consumer knowledge of the many benefits of the products-better speed, memory, durability, efficiency, performance, and fewer timing delays- is growing, boosting the market growth.
As countless of new devices are connected to the internet, IoT technology is expanding at a rate that fuels expansion. In addition, new units, such as computers, sensors, data storage devices, and associated infrastructure, explain the increased demand that these electronic components experience due to their capacity to communicate with one another and integrate into networks and software systems. Thus, driving the 3D IC market revenue.
3D IC Market Segment Insights:
3D IC Components Insights
The 3D IC Market segmentation, based on components, includes Through Glass Vias (TGVs), Through Silicon Vias (SGVs), and others. The through silicon vias (TGVs) segment dominated the market, accounting for maximum market revenue. TGVs are expanding exponentially due to smart electronics such as smartphones, tablets, laptops, and other devices becoming more widely used. Since these TSVs are mostly employed in constructing 3D integrated circuits (ICs) and IC packaging, which is among the essential elements in producing smart electronics. In addition, the TSVs offer the best connectivity compared to traditional flip-chips and wire bonds.
Figure 1: 3D IC Market, by Components, 2022 & 2032 (USD Billion)
Source: Secondary Research, Primary Research, MRFR Database and Analyst Review
3D IC Application Insights
The 3D IC Market segmentation, based on application, includes aerospace & industrial, telecommunication & IT, automotive, consumer electronics, medical, industrial, and others. The consumer electronics segment generated the most income. As a result of the rising demand for various innovative and small consumer electronics goods with improved functionality, such as laptops, smartphones, and tablets, the
consumer electronics industry has experienced significant growth.
3D IC Technology Insights
The 3D IC Market segmentation, based on technology, includes technology type, 3D stacked ICs, Monolithic 3D ICs, and integration and packaging type. The 3D stacked ICs segmentation has dominated the market due to its functionality, performance, power consumption, and combination of costs. Additionally, 3D stacked ICs are growing due to increased application across industries.
3D IC Products Insights
The 3D IC Market segmentation, based on products, includes 3D memory, light-emitting diodes (LEDs),
CMOS image sensors, and sensors and MEMs. The
sensors and MEMscategory generated the most income due to the functional components of MEMs microactuators, microsensors, and microelectronics. The advanced elements of MEMs are gyroscopes, digital compasses, accelerometers, inertial modules, humidity sensors, microphones, pressure sensors, and smart sensors, among others. The main need in all these elements and sensors is a miniature structure. Therefore, many sensors have started using 3D IC.
3D IC Regional Insights
By region, the study provides market insights into North America, Europe, Asia-Pacific and Rest of the World. The North American 3D IC market will dominate this market due to the massive demand for security systems and business intelligence. Additionally, the easy availability of raw materials and increasing demand for 3D integrated circuits will boost the market growth in this region. Further, the major countries studied in the market report are The US, Canada, German, France, the UK, Italy, Spain, China, Japan, India, Australia, South Korea, and Brazil.
Figure 2: 3D IC Market SHARE BY REGION 2022 (USD Billion)
Source: Secondary Research, Primary Research, MRFR Database and Analyst Review
Europe 3D IC market accounts for the second-largest market share due to rising demand for IoT-based electronics. Further, the German 3D IC market held the largest market share, and the UK 3D IC market was the fastest-growing market in the European region. The Asia-Pacific 3D IC Market is expected to grow at the fastest CAGR from 2023 to 2032 due to rising demand for consumer electronics and the use of smart devices. Moreover, China’s 3D IC market held the largest market share, and the Indian 3D IC market was the fastest-growing market in the Asia-Pacific region.
3D IC Key Market Players & Competitive Insights
Leading market players are investing heavily in research and development to expand their product lines, which will help the 3D IC market, grow even more. Market participants are also undertaking various strategic activities to expand their global footprint, with important market developments including new product launches, contractual agreements, mergers and acquisitions, higher investments, and collaboration with other organizations. To expand and survive in a more competitive and rising market climate, the 3D IC industry must offer cost-effective items. Manufacturing locally to minimize operational costs is one of the key business tactics manufacturer’s use in the global 3D IC industry to benefit clients and increase the market sector. In recent years, the 3D IC industry has offered some of the most significant advantages to 3D ICs.
Major players in the 3D IC market, including United Microelectronics Corporation, Tezzaron Semiconductor Conductor Corporation, 3M Company Besang Inc., IBM Corporation, Xilinx Inc., Monolithic 3D Inc., Intel Corporation, Toshiba Corp. Amkor Technology, Samsung Electronics Co. Ltd., and others, are attempting to increase market demand by investing in research and development operations. Siemens Digital Industries Software is an American computer software organization specializing in 3D & 2D Product Lifecycle Management tools. The corporation, which has its corporate headquarters in Plano, Texas, goes by the legal name Siemens Industry Software Inc.
For Instance: September 2022, Siemens Digital Industries Software and United Microelectronics (UMC), a top semiconductor foundry, announced the creation of a workflow for 3D integrated circuits (ICs) hybrid bonding. For UMC’s wafer-on-wafer and chip-on-wafer technologies, businesses have created a new multi-chip 3D IC planning, assembly validation, and parasitic extraction (PEX) workflow. STMicroelectronics N.V., sometimes known as ST or STMicro, is a Dutch global firm specializing in technology with French and Italian roots. Its headquarters are Plan-les-Ouates, which is close to Geneva, Switzerland and listed on the French stock exchange. The largest semiconductor, contract manufacturing and design business in Europe is ST. In 1987, Thomson Semiconductors of France and SGS Microeletronica of Italy, two government-owned semiconductor businesses, merged to form the corporation.
For instance: in September 2022, a sophisticated VDA-complaint LIN alternator regulator was revealed by STMicroelectronics, a British company, to improve the performance and adaptability of 12V automotive systems. With the help of a 3D IC and improved functionality, STMicroelectronics unveiled the L9918 automotive alternator regulator to guarantee the reliability of 12V automotive systems. L9918 allows users to specify settings such as alternator characteristics and voltage set points.
Key Companies in the 3D IC market include
- United Microelectronics Corporation
- Tezzaron Semiconductor Conductor Corporation
- 3M Company Besang Inc.
- IBM Corporation
- Xilinx Inc.
- Monolithic 3D Inc.
- Intel Corporation
- Toshiba Corp. Amkor Technology
- Samsung Electronics Co. Ltd.
3D IC Industry Developments
March 2022: Amkor Technology, a trade with South Korea headquarters, joins hands with the TSMC OIP 3D Fabric. With initial access to TSMC’s 3D Fabric technology, the new 3D Fabric Alliance’s partners can advance their products parallel with TSMC. They can also propose a steady supply of 2.5 ICs and 3D ICs of premium quality.
October 2021: Cadence Design Systems, Inc announced the delivery of the Integrity 3D-IC platform. It is the first 3D IC platform on the market to combine system analysis, design planning, and high capacity 3D implementation into a unified cockpit.
May 2021: Intel expects to spend USD 3.5 billion upgrading its Rio Rancho facility, one of its three main US manufacturing hubs, and aiding more than 35% of its workforce there. It is enlarging its facilities in New Mexico to produce new generations of chips based on its Foveros 3D packaging technology, which might support the business’s efforts to restore its position as the market leader in the semiconductor sector.
3D IC Market Segmentation:
3D IC Components Outlook
- Through Glass Vias (TGVs)
- Through Silicon Vias (TSVs)
- Others
3D IC Application Outlook
- Aerospace & Industrial
- Telecommunication & IT
- Automotive
- Consumer Electronics
- Medical
- Industrial
- Others
3D IC Technology Outlook
- Technology Type
- 3D Stacked ICs
- Monolithic 3D ICs
- Integration and Packaging Type
3D IC Products Outlook
- 3D memory
- Light Emitting Diodes (LEDs)
- CMOS Image Sensors
- Sensors and MEMs
3D IC Regional Outlook
- North America
- US
- Canada
- Europe
- Germany
- France
- UK
- Italy
- Spain
- Rest of Europe
- Asia-Pacific
- China
- Japan
- India
- Australia
- South Korea
- Australia
- Rest of Asia-Pacific
- Rest of the World
- Middle East
- Africa
- Latin America
Market Size & Forecast
| Attribute/Metric | Details |
| Market Size 2023 | USD 9.6 Billion |
| Market Size 2024 | USD 11.52 Billion |
| Market Size 2032 | USD 41.5 Billion |
| Compound Annual Growth Rate (CAGR) | 17.36% (2024-2032) |
| Base Year | 2023 |
| Market Forecast Period | 2024-2032 |
| Historical Data | 2018- 2022 |
| Market Forecast Units | Value (USD Billion) |
| Report Coverage | Revenue Forecast, Market Competitive Landscape, Growth Factors, and Trends |
| Segments Covered | Components, Applications, Technology, Products, and Region |
| Geographies Covered | North America, Europe, Asia Pacific, and the Rest of the World |
| Countries Covered | The US, Canada, German, France, UK, Italy, Spain, China, Japan, India, Australia, South Korea, and Brazil |
| Key Companies Profiled | GUnited Microelectronics Corporation, Tezzaron Semiconductor Conductor Corporation, 3M Company Besang Inc., IBM Corporation, Xilinx Inc., Monolithic 3D Inc., Intel Corporation, Toshiba Corp., Amkor Technology, Samsung Electronics Co. Ltd. |
| Key Market Opportunities | High-speed data transmission |
| Key Market Dynamics | Increase in demand for advanced electronic productsHigh demand for 3D packaging using TSVs |
Major Players
3D IC Market Segmentation
3D IC Components Outlook (USD Billion, 2018-2032)
Through Glass Vias (TGVs)
Through Silicon Vias (TSVs)
Others
3D IC Application Outlook (USD Billion, 2018-2032)
Aerospace & Industrial
Telecommunication & IT
Automotive
Consumer Electronics
Medical
Industrial
Others
3D IC Technology Outlook (USD Billion, 2018-2032)
Technology Type
3D Stacked ICs
Monolithic 3D ICs
Integration and Packaging Type
3D IC Products Outlook (USD Billion, 2018-2032)
3D Memory
Light Emitting Diodes (LEDs)
CMOS Image Sensors
Sensors and MEMs
3D IC Regional Outlook (USD Billion, 2018-2032)
North America Outlook (USD Billion, 2018-2032)
North America 3D IC by Components
Through Glass Vias (TGVs)
Through Silicon Vias (TSVs)
Others
North America 3D IC by Application
Aerospace & Industrial
Telecommunication & IT
Automotive
Consumer Electronics
Medical
Industrial
Others
North America 3D IC by Technology
Technology Type
3D Stacked ICs
Monolithic 3D ICs
Integration and Packaging Type
North America 3D IC by Products
3D Memory
Light Emitting Diodes (LEDs)
CMOS Image Sensors
Sensors and MEMs
US Outlook (USD Billion, 2018-2032)
US 3D IC by Components
Through Glass Vias (TGVs)
Through Silicon Vias (TSVs)
Others
US 3D IC by Application
Aerospace & Industrial
Telecommunication & IT
Automotive
Consumer Electronics
Medical
Industrial
Others
US 3D IC by Technology
Technology Type
3D Stacked ICs
Monolithic 3D ICs
Integration and Packaging Type
US 3D IC by Products
3D Memory
Light Emitting Diodes (LEDs)
CMOS Image Sensors
Sensors and MEMs
CANADA Outlook (USD Billion, 2018-2032)
CANADA 3D IC by Components
Through Glass Vias (TGVs)
Through Silicon Vias (TSVs)
Others
CANADA 3D IC by Application
Aerospace & Industrial
Telecommunication & IT
Automotive
Consumer Electronics
Medical
Industrial
Others
CANADA 3D IC by Technology
Technology Type
3D Stacked ICs
Monolithic 3D ICs
Integration and Packaging Type
CANADA 3D IC by Products
3D Memory
Light Emitting Diodes (LEDs)
CMOS Image Sensors
Sensors and MEMs
Europe Outlook (USD Billion, 2018-2032)
Europe 3D IC by Components
Through Glass Vias (TGVs)
Through Silicon Vias (TSVs)
Others
Europe 3D IC by Application
Aerospace & Industrial
Telecommunication & IT
Automotive
Consumer Electronics
Medical
Industrial
Others
Europe 3D IC by Technology
Technology Type
3D Stacked ICs
Monolithic 3D ICs
Integration and Packaging Type
Europe 3D IC by Products
3D Memory
Light Emitting Diodes (LEDs)
CMOS Image Sensors
Sensors and MEMs
Germany Outlook (USD Billion, 2018-2032)
Germany 3D IC by Components
Through Glass Vias (TGVs)
Through Silicon Vias (TSVs)
Others
Germany 3D IC by Application
Aerospace & Industrial
Telecommunication & IT
Automotive
Consumer Electronics
Medical
Industrial
Others
Germany 3D IC by Technology
Technology Type
3D Stacked ICs
Monolithic 3D ICs
Integration and Packaging Type
Germany 3D IC by Products
3D Memory
Light Emitting Diodes (LEDs)
CMOS Image Sensors
Sensors and MEMs
France Outlook (USD Billion, 2018-2032)
France 3D IC by Components
Through Glass Vias (TGVs)
Through Silicon Vias (TSVs)
Others
France 3D IC by Application
Aerospace & Industrial
Telecommunication & IT
Automotive
Consumer Electronics
Medical
Industrial
Others
France 3D IC by Technology
Technology Type
3D Stacked ICs
Monolithic 3D ICs
Integration and Packaging Type
France 3D IC by Products
3D Memory
Light Emitting Diodes (LEDs)
CMOS Image Sensors
Sensors and MEMs
UK Outlook (USD Billion, 2018-2032)
UK 3D IC by Components
Through Glass Vias (TGVs)
Through Silicon Vias (TSVs)
Others
UK 3D IC by Application
Aerospace & Industrial
Telecommunication & IT
Automotive
Consumer Electronics
Medical
Industrial
Others
UK 3D IC by Technology
Technology Type
3D Stacked ICs
Monolithic 3D ICs
Integration and Packaging Type
UK 3D IC by Products
3D Memory
Light Emitting Diodes (LEDs)
CMOS Image Sensors
Sensors and MEMs
ITALY Outlook (USD Billion, 2018-2032)
ITALY 3D IC by Components
Through Glass Vias (TGVs)
Through Silicon Vias (TSVs)
Others
ITALY 3D IC by Application
Aerospace & Industrial
Telecommunication & IT
Automotive
Consumer Electronics
Medical
Industrial
Others
ITALY 3D IC by Technology
Technology Type
3D Stacked ICs
Monolithic 3D ICs
Integration and Packaging Type
ITALY 3D IC by Products
3D Memory
Light Emitting Diodes (LEDs)
CMOS Image Sensors
Sensors and MEMs
SPAIN Outlook (USD Billion, 2018-2032)
Spain 3D IC by Components
Through Glass Vias (TGVs)
Through Silicon Vias (TSVs)
Others
Spain 3D IC by Application
Aerospace & Industrial
Telecommunication & IT
Automotive
Consumer Electronics
Medical
Industrial
Others
Spain 3D IC by Technology
Technology Type
3D Stacked ICs
Monolithic 3D ICs
Integration and Packaging Type
Spain 3D IC by Products
3D Memory
Light Emitting Diodes (LEDs)
CMOS Image Sensors
Sensors and MEMs
Rest Of Europe Outlook (USD Billion, 2018-2032)
Rest Of Europe 3D IC by Components
Through Glass Vias (TGVs)
Through Silicon Vias (TSVs)
Others
REST OF EUROPE 3D IC by Application
Aerospace & Industrial
Telecommunication & IT
Automotive
Consumer Electronics
Medical
Industrial
Others
REST OF EUROPE 3D IC by Technology
Technology Type
3D Stacked ICs
Monolithic 3D ICs
Integration and Packaging Type
REST OF EUROPE 3D IC by Products
3D Memory
Light Emitting Diodes (LEDs)
CMOS Image Sensors
Sensors and MEMs
Asia-Pacific Outlook (USD Billion, 2018-2032)
Asia-Pacific 3D IC by Components
Through Glass Vias (TGVs)
Through Silicon Vias (TSVs)
Others
Asia-Pacific 3D IC by Application
Aerospace & Industrial
Telecommunication & IT
Automotive
Consumer Electronics
Medical
Industrial
Others
Asia-Pacific 3D IC by Technology
Technology Type
3D Stacked ICs
Monolithic 3D ICs
Integration and Packaging Type
Asia-Pacific 3D IC by Products
3D Memory
Light Emitting Diodes (LEDs)
CMOS Image Sensors
Sensors and MEMs
China Outlook (USD Billion, 2018-2032)
China 3D IC by Components
Through Glass Vias (TGVs)
Through Silicon Vias (TSVs)
Others
China 3D IC by Application
Aerospace & Industrial
Telecommunication & IT
Automotive
Consumer Electronics
Medical
Industrial
Others
China 3D IC by Technology
Technology Type
3D Stacked ICs
Monolithic 3D ICs
Integration and Packaging Type
China 3D IC by Products
3D Memory
Light Emitting Diodes (LEDs)
CMOS Image Sensors
Sensors and MEMs
Japan Outlook (USD Billion, 2018-2032)
Japan 3D IC by Components
Through Glass Vias (TGVs)
Through Silicon Vias (TSVs)
Others
Japan 3D IC by Application
Aerospace & Industrial
Telecommunication & IT
Automotive
Consumer Electronics
Medical
Industrial
Others
Japan 3D IC by Technology
Technology Type
3D Stacked ICs
Monolithic 3D ICs
Integration and Packaging Type
Japan 3D IC by Products
3D Memory
Light Emitting Diodes (LEDs)
CMOS Image Sensors
Sensors and MEMs
India Outlook (USD Billion, 2018-2032)
India 3D IC by Components
Through Glass Vias (TGVs)
Through Silicon Vias (TSVs)
Others
India 3D IC by Application
Aerospace & Industrial
Telecommunication & IT
Automotive
Consumer Electronics
Medical
Industrial
Others
India 3D IC by Technology
Technology Type
3D Stacked ICs
Monolithic 3D ICs
Integration and Packaging Type
India 3D IC by Products
3D Memory
Light Emitting Diodes (LEDs)
CMOS Image Sensors
Sensors and MEMs
Australia Outlook (USD Billion, 2018-2032)
Australia 3D IC by Components
Through Glass Vias (TGVs)
Through Silicon Vias (TSVs)
Others
Australia 3D IC by Application
Aerospace & Industrial
Telecommunication & IT
Automotive
Consumer Electronics
Medical
Industrial
Others
Australia 3D IC by Technology
Technology Type
3D Stacked ICs
Monolithic 3D ICs
Integration and Packaging Type
Australia 3D IC by Products
3D Memory
Light Emitting Diodes (LEDs)
CMOS Image Sensors
Sensors and MEMs
Rest of Asia-Pacific Outlook (USD Billion, 2018-2032)
Rest of Asia-Pacific 3D IC by Components
Through Glass Vias (TGVs)
Through Silicon Vias (TSVs)
Others
Rest of Asia-Pacific 3D IC by Application
Aerospace & Industrial
Telecommunication & IT
Automotive
Consumer Electronics
Medical
Industrial
Others
Rest of Asia-Pacific 3D IC by Technology
Technology Type
3D Stacked ICs
Monolithic 3D ICs
Integration and Packaging Type
Rest of Asia-Pacific 3D IC by Products
3D Memory
Light Emitting Diodes (LEDs)
CMOS Image Sensors
Sensors and MEMs
Rest of the World Outlook (USD Billion, 2018-2032)
Rest of the World 3D IC by Components
Through Glass Vias (TGVs)
Through Silicon Vias (TSVs)
Others
Rest of the World 3D IC by Application
Aerospace & Industrial
Telecommunication & IT
Automotive
Consumer Electronics
Medical
Industrial
Others
Rest of the World 3D IC by Technology
Technology Type
3D Stacked ICs
Monolithic 3D ICs
Integration and Packaging Type
Rest of the World 3D IC by Products
3D Memory
Light Emitting Diodes (LEDs)
CMOS Image Sensors
Sensors and MEMs
Middle East Outlook (USD Billion, 2018-2032)
Middle East 3D IC by Components
Through Glass Vias (TGVs)
Through Silicon Vias (TSVs)
Others
Middle East 3D IC by Application
Aerospace & Industrial
Telecommunication & IT
Automotive
Consumer Electronics
Medical
Industrial
Others
Middle East 3D IC by Technology
Technology Type
3D Stacked ICs
Monolithic 3D ICs
Integration and Packaging Type
Middle East 3D IC by Products
3D Memory
Light Emitting Diodes (LEDs)
CMOS Image Sensors
Sensors and MEMs
Africa Outlook (USD Billion, 2018-2032)
Africa 3D IC by Components
Through Glass Vias (TGVs)
Through Silicon Vias (TSVs)
Others
Africa 3D IC by Application
Aerospace & Industrial
Telecommunication & IT
Automotive
Consumer Electronics
Medical
Industrial
Others
Africa 3D IC by Technology
Technology Type
3D Stacked ICs
Monolithic 3D ICs
Integration and Packaging Type
Africa 3D IC by Products
3D Memory
Light Emitting Diodes (LEDs)
CMOS Image Sensors
Sensors and MEMs
Latin America Outlook (USD Billion, 2018-2032)
Latin America 3D IC by Components
Through Glass Vias (TGVs)
Through Silicon Vias (TSVs)
Others
Latin America 3D IC by Application
Aerospace & Industrial
Telecommunication & IT
Automotive
Consumer Electronics
Medical
Industrial
Others
Latin America 3D IC by Technology
Technology Type
3D Stacked ICs
Monolithic 3D ICs
Integration and Packaging Type
Latin America 3D IC by Products
3D Memory
Light Emitting Diodes (LEDs)
CMOS Image Sensors
Sensors and MEMs
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