3D Semiconductor Packaging Market

Global 3D Semiconductor Packaging Market Overview:

3D Semiconductor Packaging Market Size valued at USD 12.2 Billion in 2023. The 3D Semiconductor Packaging market industry is projected to grow from USD 14.1825 Billion in 2024 to USD 40.7 Billion by 2032, exhibiting a compound annual growth rate (CAGR) of 14.09% during the forecast period (2024 - 2032). Increased demand for the miniaturization of electric devices and fast growth in information and communications industries are the key market drivers enhancing the growth of market.

Source: The Secondary Research, Primary Research, MRFR Database, and Analyst Review

3D Semiconductor Packaging Market Trends

• Growing demand for miniaturization in electric devices is driving the market growth.

Market CAGR for 3D semiconductor packaging is being driven by the rising demand for miniaturization in electric devices. The rising demand for devices with high capacity and less storage is expected to increase the demand for 3D semiconductor packaging. The tendency towards miniaturization is becoming important in the creation and design of electronic devices. The method provides important advantages like heterogeneous integration, in which the circuit layers are designed using different processes on different wafers.

Microelectronic devices consist of small surgical apparatus used in the healthcare industry and miniature MEMS devices employed in electronic products and others. These devices consist of different integrated chips, in which the producers emphasize their size minimization. Low power and small-size consumption are the main factors driving the demand for chips with several advanced semiconductor packaging techniques, from which one is 3D packaging design. The demand for the compact electronic circuit is boosted with the reduced size of electronic devices for ease of access for customers. The increasing technological superiorities over 2D packaging technology, increase in requirement for miniaturized circuits in microelectronic devices, growing demand for tablets, wearable devices, low-end smartphones, and other connected consumer goods, rising demand for consumer electronic products, increasing sales of MEMS devices, enhanced efficiency, and less power consumption are main factors boosting the growth of 3D semiconductor packaging market.

Compared to traditional wired technologies, 3D integrated circuit wires have a huge capacitance. Sensitive circuits are further separated into different levels to conceal the purpose of each layer. Greater chip connectivity compared to conventional layouts is another goal of 3D IC technology. Products currently are getting smaller while incorporating greater utility. It is typical for the miniaturization of one stage of a product to disclose constraints and challenges in the entire design and production process.

The latest advancement in technologies has new gadgets coming up in the market, like e-book readers, tablet computers, gaming devices, 3D smart glass, and virtual reality products that demand s high-performance electronic components. The market expansion is expected to be boosted by the increase in demand for compact electronic devices in end-user sections like healthcare, consumer electronics, and automotive. The key market participants are focusing on making electrical goods smaller, which is one of the essential components of contemporary consumer goods. Tiny gadgets are utilized in the technology industries and medicine. Thus, driving the 3D Semiconductor Packaging market revenue.

3D Semiconductor Packaging Market Segment Insights:

3D Semiconductor Packaging Technology Insights

The 3D Semiconductor Packaging Market segmentation, based on technology, includes 3D Through Silicon Via, 3D Package on Package, 3D Fan Out Based, and 3D Wire Bonded. The 3D through silicon via segment dominates the market, accounting for the largest market revenue due to the rising demand for TSV-based packages owing to their superior performance features like high-speed data transfer and low power consumption compared to traditional 2D packages.

3D Semiconductor Packaging End User Insights

The 3D Semiconductor Packaging Market segmentation, based on end users, includes Telecommunication, Consumer Electronics, Industrial, and Others. The consumer electronics segment dominates the market owing to the growing use of 3D semiconductors in flat panel television sets, personal computers, and other home appliances. The rapid development of smart devices is expected to boost growth of market during the forecast years. 3D semiconductor packaging can be utilized in several industrial applications, including aerospace, electronic devices, defense equipment, medical systems and devices, and consumer electronics. The 3D semiconductor packaging prevents devices from being damaged by exterior forces and offers a more efficient and secure way of packing components, and minimizes the heat fluxes within electronic modules, leading to enhanced performance and stability.

Figure 1: 3D Semiconductor Packaging Market by End User, 2022 & 2032 (USD Billion)

Source: The Secondary Research, Primary Research, MRFR Database and Analyst Review

3D Semiconductor Packaging Regional Insights

By region, the study offers market insights into North America, Europe, Asia-Pacific, and the Rest of the World. The North American 3D Semiconductor Packaging market area, dominates the market due to the strong growth of the electronics industry and the preference for miniaturized electronic devices that are compact and don't compromise on power. Further, the fast adoption of high-end electronic devices and the growth of machine learning and AI technologies in this region is anticipated to boost the growth of the market.

Further, the prime countries studied in the market report are the US, Canada, German, France, the UK, Italy, Spain, Japan, India, China, Australia, South Korea, and Brazil.

Figure 2: 3D Semiconductor Packaging Market SHARE BY REGION 2022 (USD Billion)

Source: The Secondary Research, Primary Research, MRFR Database, and Analyst Review

The Asia-Pacific 3D Semiconductor Packaging Market accounts for the second-largest market revenue due to the rising production of semiconductors and large range usage of 3D semiconductor packaging, and the presence of key market players in this region. Moreover, China’s 3D Semiconductor Packaging market held the largest market share, and the Indian 3D Semiconductor Packaging market was the rapid-growing market in the Asia-Pacific region.

Europe's 3D Semiconductor Packaging market is expected to grow at the fastest CAGR from 2023 to 2032. This is due to the rising adoption of 3D semiconductor packaging in this region. Further, the German 3D Semiconductor Packaging market held the largest market share, and the UK 3D Semiconductor Packaging market was the fastest-growing market in the European region.

3D Semiconductor Packaging Key Market Players & Competitive Insights

Leading market players are investing heavily in research and development in order to expand their product lines, which will help the 3D Semiconductor Packaging market grow even more. Market players are also undertaking various strategic activities to expand their global footprint, with important market developments including new product launches, contractual agreements, mergers and acquisitions, higher investments, and collaboration with other organizations. To expand and survive in a more competitive and rising market climate, the 3D Semiconductor Packaging industry must offer cost-effective items.

Manufacturing locally to minimize operational costs is one of the key business tactics used by manufacturers in the global 3D Semiconductor Packaging industry to benefit clients and increase the market sector. In recent years, the 3D Semiconductor Packaging industry has offered some of the most significant advantages to electronic industries. Major players in the 3D Semiconductor Packaging market, including Samsung Electronics Co Ltd., United Microelectronics Corporation, Intel Corporation, ACM Research, Taiwan Semiconductor Manufacturing Company, ASE Technology Holdings Co. Ltd., Amkor Technology, Jiangsu Changjiang Electronics Technology Co. Ltd., and others, are attempting to increase market demand by investing in research and development operations.

Samsung Electronics, founded on March 1938, is a South Korean company, one of the world's largest producers of electronic devices. The company specializes in the production of a large variety of consumer and industry electronics, including appliances, semiconductors, digital media devices, integrated systems, and memory chips. The company has become one of the most recognizable brands in technology and manufactures about a fifth of South Korea's total exports. In July 2022, Samsung Electronics Co. initiated its mass manufacturing of 3-nanometer semiconductor chips for a Chinese cryptocurrency miner. These chips are expected to minimize power consumption by 50% and enhance performance by 30%, as stated by Samsung Electronics Co.

United Microelectronics Corporation, a Taiwanese company based in Hsinchu, Taiwan, is a leading global semiconductor foundry company, providing high-quality IC fabrication services, emphasizing logic different specialty technologies to serve all main sectors of the electronics industry. The company designs produces, and markets ICs and related electronic products. The main products of the company are consumer electronics ICs, personal computer peripheral ICs, memory ICs, and communication ICs. In February 2023, the company and Cadence collaborated on 3D-IC Hybrid Bonding Reference Flow. This technology helps the integration throughout a large range of technology nodes suitable for edge AI, wireless communication applications, and image processing. The design reliability and cost-effectiveness are factors of UMC's hybrid bonding technologies, and partnership with Cadence offers mutual customers helping them reap the benefits of 3D structures.

Key Companies in the 3D Semiconductor Packaging market include

• Samsung Electronics Co Ltd.

• United Microelectronics Corporation

• Intel Corporation

• ACM Research

• Taiwan Semiconductor Manufacturing Company

• ASE Technology Holdings Co. Ltd.

• Amkor Technology

• Jiangsu Changjiang Electronics Technology Co. Ltd.

3D Semiconductor Packaging Industry Developments

In June 2024, at a press release that showed its unveiling of innovations in producing semiconductor package substrates, the Japanese company and a chemical manufacturer, Shin-Etsu Chemical Co., Ltd., explained their work with micro-LED manufacturers on new technologies and also their equipment for the company.

In February 2024, it came to light that there are other companies that are working and competing with Intel Corporation, which is primarily engaged in manufacturing and selling microprocessors for computers. Intel confirmed further developments with a foundry strategy targeted towards the AI Age. By 2030, Intel intends to be the second-largest foundry globally. Three other executives that were in attendance were Open AI Sam Altman, Arm CEO Rene Hass production capabilities, and U.S. Secretary Gina Raimondo. A steering roadmap that entails guardians for Intel 3, Intel 18A, and Intel 14A processes has also been shifted.

In 2023, Intel continued to innovate with the introduction of new packaging systems. They announced a novel form of semiconductor packaging called Foveros Omni which is a three-dimensional stacked configuration packaging technology that allows several dies to be placed one on top of the other in order to greatly enhance the performance level of the power efficiency ratio.

In November 2022, a Samsung semiconductor project for a wafer-to-wafer to three-dimensional IC was launched with Engro’s Nebula project which was developed in partnership with Advanced Semiconductor Engineering Incorporation as a package company. Other companies that joined in this initiative include Cadence, Faraday Technology and Winbond Electronics. The growth in 3D tools has now been increased by the semiconductor manufacturing company based in Taiwan with W2W technology for their major clients.

In 2022, ASE Group claimed to have made a substantial breakthrough with the introduction of CoWoS Plus adding to the growing list of advancements within the semiconductor packaging sector. CoWoS Plus is a fan-out wafer-level packaging technology that promises to reduce the number of dies required than that of other available fan-out wafer-level packaging technologies, ultimately improving the cost and performance aspects of the unit.

July 2022: The production of 3D semiconductor chips was announced by Intel Corporation for Media Tek, a Taiwan chip design firm. The first product will be utilized in smart devices with the assistance of Intel 16 technology. This will help Intel Corporation to fuel its foundry business.

March 2022: KaraMD announced Pure Health Apple Cider Vinegar Gummies, a vegan gummy aimed to aid ketosis, digestion regulation, weight management, and encourage greater levels of energy.

3D Semiconductor Packaging Market Segmentation:

3D Semiconductor Packaging Type Outlook

• 3D Through Silicon Via

• 3D Package on Package

• 3D Fan Out Based

• 3D Wire Bonded

3D Semiconductor Packaging End User Outlook

• Telecommunication

• Consumer Electronics

• Industrial

• Others

3D Semiconductor Packaging Regional Outlook

• North America

  • US

  • Canada

• Europe

  • Germany

  • France

  • UK

  • Italy

  • Spain

  • Rest of Europe

• Asia-Pacific

  • China

  • Japan

  • India

  • Australia

  • South Korea

  • Australia

  • Rest of Asia-Pacific

• Rest of the World

  • Middle East

  • Africa

  • Latin America

3D Semiconductor Packaging Market Segmentation

3D Semiconductor Packaging Type Outlook (USD Billion, 2018-2032)

• 3D Through Silicon Via

• 3D Package on Package

• 3D Fan Out Based

• 3D Wire Bonded

3D Semiconductor Packaging End User Outlook (USD Billion, 2018-2032)

• Telecommunication

• Consumer Electronics

• Industrial

• Others

3D Semiconductor Packaging Regional Outlook (USD Billion, 2018-2032)

• North America Outlook (USD Billion, 2018-2032)

  • North America 3D Semiconductor Packaging by Type

    • 3D Through Silicon Via

    • 3D Package on Package

    • 3D Fan Out Based

    • 3D Wire Bonded

  • North America 3D Semiconductor Packaging by End User

    • Telecommunication

    • Consumer Electronics

    • Industrial

    • Others

  • US Outlook (USD Billion, 2018-2032)

  • US 3D Semiconductor Packaging by Type

    • 3D Through Silicon Via

    • 3D Package on Package

    • 3D Fan Out Based

    • 3D Wire Bonded

  • US 3D Semiconductor Packaging by End User

    • Telecommunication

    • Consumer Electronics

    • Industrial

    • Others

  • CANADA Outlook (USD Billion, 2018-2032)

  • CANADA 3D Semiconductor Packaging by Type

    • 3D Through Silicon Via

    • 3D Package on Package

    • 3D Fan Out Based

    • 3D Wire Bonded

  • CANADA 3D Semiconductor Packaging by End User

    • Telecommunication

    • Consumer Electronics

    • Industrial

    • Others

• Europe Outlook (USD Billion, 2018-2032)

  • Europe 3D Semiconductor Packaging by Type

    • 3D Through Silicon Via

    • 3D Package on Package

    • 3D Fan Out Based

    • 3D Wire Bonded

  • Europe 3D Semiconductor Packaging by End User

    • Telecommunication

    • Consumer Electronics

    • Industrial

    • Others

  • Germany Outlook (USD Billion, 2018-2032)

  • Germany 3D Semiconductor Packaging by Type

    • 3D Through Silicon Via

    • 3D Package on Package

    • 3D Fan Out Based

    • 3D Wire Bonded

  • Germany 3D Semiconductor Packaging by End User

    • Telecommunication

    • Consumer Electronics

    • Industrial

    • Others

  • France Outlook (USD Billion, 2018-2032)

  • France 3D Semiconductor Packaging by Type

    • 3D Through Silicon Via

    • 3D Package on Package

    • 3D Fan Out Based

    • 3D Wire Bonded

  • France 3D Semiconductor Packaging by End User

    • Telecommunication

    • Consumer Electronics

    • Industrial

    • Others

  • UK Outlook (USD Billion, 2018-2032)

  • UK 3D Semiconductor Packaging by Type

    • 3D Through Silicon Via

    • 3D Package on Package

    • 3D Fan Out Based

    • 3D Wire Bonded

  • UK 3D Semiconductor Packaging by End User

    • Telecommunication

    • Consumer Electronics

    • Industrial

    • Others

  • ITALY Outlook (USD Billion, 2018-2032)

  • ITALY 3D Semiconductor Packaging by Type

    • 3D Through Silicon Via

    • 3D Package on Package

    • 3D Fan Out Based

    • 3D Wire Bonded

  • ITALY 3D Semiconductor Packaging by End User

    • Telecommunication

    • Consumer Electronics

    • Industrial

    • Others

  • SPAIN Outlook (USD Billion, 2018-2032)

  • Spain 3D Semiconductor Packaging by Type

    • 3D Through Silicon Via

    • 3D Package on Package

    • 3D Fan Out Based

    • 3D Wire Bonded

  • Spain 3D Semiconductor Packaging by End User

    • Telecommunication

    • Consumer Electronics

    • Industrial

    • Others

  • Rest Of Europe Outlook (USD Billion, 2018-2032)

  • Rest Of Europe 3D Semiconductor Packaging by Type

    • 3D Through Silicon Via

    • 3D Package on Package

    • 3D Fan Out Based

    • 3D Wire Bonded

  • REST OF EUROPE 3D Semiconductor Packaging by End User

    • Telecommunication

    • Consumer Electronics

    • Industrial

    • Others

  • Asia-Pacific Outlook (USD Billion, 2018-2032)

  • Asia-Pacific 3D Semiconductor Packaging by Type

    • 3D Through Silicon Via

    • 3D Package on Package

    • 3D Fan Out Based

    • 3D Wire Bonded

  • Asia-Pacific 3D Semiconductor Packaging by End User

    • Telecommunication

    • Consumer Electronics

    • Industrial

    • Others

  • China Outlook (USD Billion, 2018-2032)

  • China 3D Semiconductor Packaging by Type

    • 3D Through Silicon Via

    • 3D Package on Package

    • 3D Fan Out Based

    • 3D Wire Bonded

  • China 3D Semiconductor Packaging by End User

    • Telecommunication

    • Consumer Electronics

    • Industrial

    • Others

  • Japan Outlook (USD Billion, 2018-2032)

  • Japan 3D Semiconductor Packaging by Type

    • 3D Through Silicon Via

    • 3D Package on Package

    • 3D Fan Out Based

    • 3D Wire Bonded

  • Japan 3D Semiconductor Packaging by End User

    • Telecommunication

    • Consumer Electronics

    • Industrial

    • Others

  • India Outlook (USD Billion, 2018-2032)

  • India 3D Semiconductor Packaging by Type

    • 3D Through Silicon Via

    • 3D Package on Package

    • 3D Fan Out Based

    • 3D Wire Bonded

  • India 3D Semiconductor Packaging by End User

    • Telecommunication

    • Consumer Electronics

    • Industrial

    • Others

  • Australia Outlook (USD Billion, 2018-2032)

  • Australia 3D Semiconductor Packaging by Type

    • 3D Through Silicon Via

    • 3D Package on Package

    • 3D Fan Out Based

    • 3D Wire Bonded

  • Australia 3D Semiconductor Packaging by End User

    • Telecommunication

    • Consumer Electronics

    • Industrial

    • Others

  • Rest of Asia-Pacific Outlook (USD Billion, 2018-2032)

  • Rest of Asia-Pacific 3D Semiconductor Packaging by Type

    • 3D Through Silicon Via

    • 3D Package on Package

    • 3D Fan Out Based3D Wire Bonded

  • Rest of Asia-Pacific 3D Semiconductor Packaging by End User

    • Telecommunication

    • Consumer Electronics

    • Industrial

    • Others

  • Rest of the World Outlook (USD Billion, 2018-2032)

  • Rest of the World 3D Semiconductor Packaging by Type

    • 3D Through Silicon Via

    • 3D Package on Package

    • 3D Fan Out Based

    • 3D Wire Bonded

  • Rest of the World 3D Semiconductor Packaging by End User

    • Telecommunication

    • Consumer Electronics

    • Industrial

    • Others

  • Middle East Outlook (USD Billion, 2018-2032)

  • Middle East 3D Semiconductor Packaging by Type

    • 3D Through Silicon Via

    • 3D Package on Package

    • 3D Fan Out Based

    • 3D Wire Bonded

  • Middle East 3D Semiconductor Packaging by End User

    • Telecommunication

    • Consumer Electronics

    • Industrial

    • Others

  • Africa Outlook (USD Billion, 2018-2032)

  • Africa 3D Semiconductor Packaging by Type

    • 3D Through Silicon Via

    • 3D Package on Package

    • 3D Fan Out Based

    • 3D Wire Bonded

  • Africa 3D Semiconductor Packaging by End User

    • Telecommunication

    • Consumer Electronics

    • Industrial

    • Others

  • Latin America Outlook (USD Billion, 2018-2032)

  • Latin America 3D Semiconductor Packaging by Type

    • 3D Through Silicon Via

    • 3D Package on Package

    • 3D Fan Out Based

    • 3D Wire Bonded

  • Latin America 3D Semiconductor Packaging by End User

    • Telecommunication

    • Consumer Electronics

    • Industrial

    • Others