Semiconductor Packaging Material Market

Global Semiconductor Packaging Material Market Overview

Semiconductor Packaging Material Market Size was valued at USD 16.46 Billion in 2023. The Semiconductor Packaging Material industry is projected to grow from USD 17.82 Billion in 2024 to USD 31.15 Billion by 2032, exhibiting a compound annual growth rate (CAGR) of 7.23% during the forecast period (2024 - 2032). the increasing demand across multiple end-user verticals of the business, and as a result of this increased need, packaging has undergone a continual revolution in terms of product attributes, integration, and energy efficiency are the key market drivers enhancing the market growth.

Source: Secondary Research, Primary Research, MRFR Database and Analyst Review

Semiconductor Packaging Material Market Trends

• Growing use in consumer electronics is driving the market growth.

Market CAGR for semiconductor packaging material is being driven by the rising use in consumer electronics. The expanding use of consumer electronics due to rising per capita incomes worldwide and the greater affordability of electronic equipment due to improving living standards is predicted to drive the semiconductor packaging market size internationally. Consumer electronics items such as laptops, fitness bands, tablets, smartwatches, and other electronic gadgets that need complicated semiconductor integration are projected to boost the semiconductor packaging industry's growth.

The increased usage of 3D semiconductor packaging technology is expected to create new opportunities for developing semiconductor packaging market share throughout the forecast period. To meet the surge in customer demand for smaller, lighter, and portable devices (such as mobile phones, PDAs, digital cameras, and others), volumetric system miniaturization and interconnection (VSMI), a method of semiconductor manufacture, is required. When 3D semiconductor packaging is compared to traditional semiconductor packaging, the items are more compact, which provides advantages. These factors are expected to broaden the range of alternatives accessible to this business. Furthermore, as demand for smartphones, devices, and the Internet of Things (IoT) grows in tandem with market revenue for semiconductor packaging, particularly fan-out wafer-level packaging, semiconductor packaging suppliers are developing procedures and strategies to reduce the overall cost of advanced packaging while maximizing operational efficiency. Because of the high cost of operation, they are typically used for high-end products and applications in specialized industries, such as wafers and die manufacture.

Additionally, market vendors may profit from diverse growth opportunities as packaging solutions continue to develop. FAB-LESS and other semiconductor design businesses can generate innovative packaging solutions. Still, they will always require an OSAT vendor to put them into practice and make the new packaging technology a reality. The major reason is the need for internal or in-house assembly and testing capabilities, which typically necessitate large investments. Using OSAT is the best way to save money while developing new package improvements. Thus, driving the Semiconductor Packaging Material market revenue.

Semiconductor Packaging Material Market Segment Insights

Semiconductor Packaging Material Product Type Insights

Based on product type, the Semiconductor Packaging Material market segmentation includes substrates, lead frames, bonding wires, encapsulants, underfill materials, die-attach, solder balls, wafer-level packaging dielectrics, and others. The underfill materials category dominated the market, accounting for 35% of market revenue. The increased demand for high-performance sophisticated electronics for retail and commercial applications is expected to help this sub-expansion category grow. Other factors contributing to the sub-segment growth include increased affordability and penetration of consumer electronics such as mobile phones and wireless due to rising per capita income worldwide.

Semiconductor Packaging Material Product Technology Insights

Based on technology, the Semiconductor Packaging Material market segmentation includes grid array, small outline package, dual flat no-leads, quad flat package, dual in-line package, and others. The grid array segment dominated the market. Because it is widely employed in all sorts of critical semiconductor packing. Significant expenditures in electronics applications, easy availability of raw materials, low-cost manufacturing, and a cheap labor force are driving category expansion.

Semiconductor Packaging Material End Use Industry Insights

Based on the end-use industry, the Semiconductor Packaging Material market segmentation includes consumer electronics, aerospace & defense, healthcare, communication, automotive, and others. The consumer electronics category generated the most income (70.4%). With a rise in spending and many electronics equipment manufacturing businesses offering consumer electronics products such as smartphones, portable digital assistants, audio devices, tablets, and others, especially in developing countries such as India, China, Vietnam, and Indonesia.

Figure 1:  Semiconductor Packaging Material Market, by End Use Industry, 2022 & 2032 (USD Billion)

Source: Secondary Research, Primary Research, MRFR Database and Analyst Review

Semiconductor Packaging Material Regional Insights

By region, the study provides market insights into North America, Europe, Asia-Pacific, and the Rest of the World. The North American Semiconductor Packaging Material market area will dominate this market, The presence of developed countries such as the United States and Canada, as well as the early adoption of cutting-edge technologies such as AI, the Internet of Things, and other products, are expected to support the growth of the North American semiconductor packaging market over the forecast period.

Further, the major countries studied in the market report are The US, Canada, German, Italy, Spain, China, Japan, India, France, the UK, Australia, South Korea, and Brazil.

Figure 2:  SEMICONDUCTOR PACKAGING MATERIAL MARKET SHARE BY REGION 2022 (USD Billion)

Source: Secondary Research, Primary Research, MRFR Database and Analyst Review

Europe has the second-largest Semiconductor Packaging Material market share. People's increased disposable income and preferences for smart homes and smart corporate settings are significant drivers of European consumer electronics growth. Furthermore, the German Semiconductor Packaging Material market dominated, while the UK Semiconductor Packaging Material market grew fastest in Europe.

From 2023 to 2032, the Asia-Pacific Semiconductor Packaging Material Market will develop at the quickest CAGR. The increasing per capita income of Asian-Pacific area inhabitants due to economic development has increased spending on semiconductor-based equipment and products such as cellphones, personal computers, high-definition (HD) television sets, and others. Furthermore, China's Semiconductor Packaging Material market had the highest market share, whereas India's Semiconductor Packaging Material market was the Asia-Pacific region's fastest growing.

Semiconductor Packaging Material Key Market Players & Competitive Insights

Leading market companies are extensively spending R&D on increasing their product lines, which will help the Semiconductor Packaging Material market grow even more. Important market developments include new product releases, contractual agreements, acquisitions and mergers, greater investments, and collaboration with other organizations. The Semiconductor Packaging Material industry must produce cost-effective merchandise to flourish and thrive in a more competitive and increasing market climate.

Manufacturing locally to reduce operating costs is an effective business strategy manufacturers use in the worldwide Semiconductor Packaging Material industry to serve clients and expand the market sector. The Semiconductor Packaging Material industry has recently provided some of the most important benefits. ASE, S2C, and other major competitors in the Semiconductor Packaging Material market seek to improve market demand by investing in R&D efforts.

ASE is producing revolutionary advanced packaging and system-in-package solutions to match growth momentum across various end areas, including 5G, Automotive, High-Performance Computing, and a large portfolio of existing assembly and test technologies. To discover more about our advancements in SiP, Fanout, Flip Chip, MEMS & Sensor, and 2.5D, 3D, and TSV technologies, all of which are ultimately aimed at applications that improve lifestyle and efficiency. In June 2022, VIPack, an innovative packaging platform designed to provide vertically integrated package solutions, was presented by Innovative Semiconductor Engineering, Inc.  VIPack is ASE's next-generation 3D heterogeneous integration architecture, which expands design principles while achieving ultra-high density and performance. The platform uses sophisticated redistribution layer (RDL) methods, embedded integration, and 2.5D and 3D technologies to enable clients to achieve unparalleled innovation when combining numerous chips into a single package.

The SK Group comprises 186 subsidiaries and affiliates that all share the SK brand name and the group's management style, known as the SKMS (SK Management System). Chey Tae-won's estate controls the group through a holding company called SK Inc. The energy and chemicals segment is the foundation of SK Group. While its primary businesses are in the energy, petroleum, and chemical industries, the group also owns SK Telecom, the nation's largest wireless mobile phone service provider. It provides services in construction, marketing, local telephone, high-speed Internet, and wireless broadband (WiBro), as well as SK Hynix, the world's fourth largest chipmaker. In July 2022, The new facility was unveiled as part of a USD 22 billion US investment package in semiconductors, renewable energy, and bioscience projects by SK Group, which owns one of the largest memory chipmakers, SK Hynix. The White House announced a USD 15 billion investment in the semiconductor sector, including R&D activities, materials, and the construction of an advanced packaging and testing facility.

Key Companies in the Semiconductor Packaging Material market include.

• Henkel,
• Hitachi Chemical Company
• Sumitomo Chemical Co., Ltd.
• Kyocera Chemical Corporation
• Toray Industries, Inc.
• Powertech Technology, Inc.
• Tianshui Huatian Technology Co. Ltd
• Fujitsu Semiconductor Limited
• UTAC Group
• Chipmos Technologies Inc
• Chipbond Technology Corporation
• Intel Corporation
• Samsung Electronics Co. Ltd
• Unisem (M) Berhad
• Interconnect Systems, Inc. (ISI)

Semiconductor Packaging Material Industry Developments

October 2022: Molex, Interconnect System Inc.'s parent company, has announced building a new plant in Guadalajara to enable sophisticated engineering and large-scale production for automotive, transportation, and industrial clients in North America and other countries.

August 2022: Intel demonstrated the most current architectural and packaging advances that enable 2.5D and 3D tile-based chip designs, ushering in a new era in chipmaking technologies and their relevance. Intel's system foundry architecture has improved packaging, and the firm plans to raise the number of transistors on a package from 100 billion to one trillion by 2030.

Semiconductor Packaging Material Market Segmentation

Semiconductor Packaging Material Product Type Outlook

• Substrates
• Lead frames
• Bonding Wires
• Encapsulants
• Underfill Materials
• Die Attach
• Solder Balls
• Wafer Level Packaging Dielectrics
• Others

Semiconductor Packaging Material Technology Outlook

• Grid Array
• Small Outline Package
• Dual Flat No-Leads
• Quad Flat Package
• Dual In-Line Package
• Others

Semiconductor Packaging Material End Use Industry Outlook

• Consumer Electronics
• Aerospace & Defense
• Healthcare
• Communication
• Automotive
• Others

Semiconductor Packaging Material Regional Outlook

• North America
  • US
  • Canada
• Europe
  • Germany
  • France
  • UK
  • Italy
  • Spain
  • Rest of Europe
• Asia-Pacific
  • China
  • Japan
  • India
  • Australia
  • South Korea
  • Australia
  • Rest of Asia-Pacific
• Rest of the World
  • Middle East
  • Africa
  • Latin America

Semiconductor Packaging Material Product Type Outlook (USD Billion, 2018-2032)

• Substrates

• Lead frames

• Bonding Wires

• Encapsulants

• Underfill Materials

• Die Attach

• Solder Balls

• Wafer Level Packaging Dielectrics

• Others

Semiconductor Packaging Material Technology Outlook (USD Billion, 2018-2032)

• Grid Array

• Small Outline Package

• Dual Flat No-Leads

• Quad Flat Package

• Dual In-Line Package

• Others

Semiconductor Packaging Material End Use Industry Outlook (USD Billion, 2018-2032)

• Consumer Electronics

• Aerospace & Defense

• Healthcare

• Communication

• Automotive

• Others

Semiconductor Packaging Material Regional Outlook (USD Billion, 2018-2032)

• North America Outlook (USD Billion, 2018-2032)

  • North America Semiconductor Packaging Material by Product Type

    • Substrates

    • Lead frames

    • Bonding Wires

    • Encapsulants

    • Underfill Materials

    • Die Attach

    • Solder Balls

    • Wafer Level Packaging Dielectrics

    • Others

  • North America Semiconductor Packaging Material by Technology

    • Grid Array

    • Small Outline Package

    • Dual Flat No-Leads

    • Quad Flat Package

    • Dual In-Line Package

    • Others

  • North America Semiconductor Packaging Material by End Use Industry

    • Consumer Electronics

    • Aerospace & Defense

    • Healthcare

    • Communication

    • Automotive

    • Others

  • US Outlook (USD Billion, 2018-2032)

  • US Semiconductor Packaging Material by Product Type

    • Substrates

    • Lead frames

    • Bonding Wires

    • Encapsulants

    • Underfill Materials

    • Die Attach

    • Solder Balls

    • Wafer Level Packaging Dielectrics

    • Others

  • US Semiconductor Packaging Material by Technology

    • Grid Array

    • Small Outline Package

    • Dual Flat No-Leads

    • Quad Flat Package

    • Dual In-Line Package

    • Others

  • US Semiconductor Packaging Material by End Use Industry

    • Consumer Electronics

    • Aerospace & Defense

    • Healthcare

    • Communication

    • Automotive

    • Others

  • CANADA Outlook (USD Billion, 2018-2032)

  • CANADA Semiconductor Packaging Material by Product Type

    • Substrates

    • Lead frames

    • Bonding Wires

    • Encapsulants

    • Underfill Materials

    • Die Attach

    • Solder Balls

    • Wafer Level Packaging Dielectrics

    • Others

  • CANADA Semiconductor Packaging Material by Technology

    • Grid Array

    • Small Outline Package

    • Dual Flat No-Leads

    • Quad Flat Package

    • Dual In-Line Package

    • Others

  • CANADA Semiconductor Packaging Material by End Use Industry

    • Consumer Electronics

    • Aerospace & Defense

    • Healthcare

    • Communication

    • Automotive

    • Others

• Europe Outlook (USD Billion, 2018-2032)

  • Europe Semiconductor Packaging Material by Product Type

    • Substrates

    • Lead frames

    • Bonding Wires

    • Encapsulants

    • Underfill Materials

    • Die Attach

    • Solder Balls

    • Wafer Level Packaging Dielectrics

    • Others

  • Europe Semiconductor Packaging Material by Technology

    • Grid Array

    • Small Outline Package

    • Dual Flat No-Leads

    • Quad Flat Package

    • Dual In-Line Package

    • Others

  • Europe Semiconductor Packaging Material by End Use Industry

    • Consumer Electronics

    • Aerospace & Defense

    • Healthcare

    • Communication

    • Automotive

    • Others

  • Germany Outlook (USD Billion, 2018-2032)

  • Germany Semiconductor Packaging Material by Product Type

    • Substrates

    • Lead frames

    • Bonding Wires

    • Encapsulants

    • Underfill Materials

    • Die Attach

    • Solder Balls

    • Wafer Level Packaging Dielectrics

    • Others

  • Germany Semiconductor Packaging Material by Technology

    • Grid Array

    • Small Outline Package

    • Dual Flat No-Leads

    • Quad Flat Package

    • Dual In-Line Package

    • Others

  • Germany Semiconductor Packaging Material by End Use Industry

    • Consumer Electronics

    • Aerospace & Defense

    • Healthcare

    • Communication

    • Automotive

    • Others

  • France Outlook (USD Billion, 2018-2032)

  • France Semiconductor Packaging Material by Product Type

    • Substrates

    • Lead frames

    • Bonding Wires

    • Encapsulants

    • Underfill Materials

    • Die Attach

    • Solder Balls

    • Wafer Level Packaging Dielectrics

    • Others

  • France Semiconductor Packaging Material by Technology

    • Grid Array

    • Small Outline Package

    • Dual Flat No-Leads

    • Quad Flat Package

    • Dual In-Line Package

    • Others

  • France Semiconductor Packaging Material by End Use Industry

    • Consumer Electronics

    • Aerospace & Defense

    • Healthcare

    • Communication

    • Automotive

    • Others

  • UK Outlook (USD Billion, 2018-2032)

  • UK Semiconductor Packaging Material by Product Type

    • Substrates

    • Lead frames

    • Bonding Wires

    • Encapsulants

    • Underfill Materials

    • Die Attach

    • Solder Balls

    • Wafer Level Packaging Dielectrics

    • Others

  • UK Semiconductor Packaging Material by Technology

    • Grid Array

    • Small Outline Package

    • Dual Flat No-Leads

    • Quad Flat Package

    • Dual In-Line Package

    • Others

  • UK Semiconductor Packaging Material by End Use Industry

    • Consumer Electronics

    • Aerospace & Defense

    • Healthcare

    • Communication

    • Automotive

    • Others

  • ITALY Outlook (USD Billion, 2018-2032)

  • ITALY Semiconductor Packaging Material by Product Type

    • Substrates

    • Lead frames

    • Bonding Wires

    • Encapsulants

    • Underfill Materials

    • Die Attach

    • Solder Balls

    • Wafer Level Packaging Dielectrics

    • Others

  • ITALY Semiconductor Packaging Material by Technology

    • Grid Array

    • Small Outline Package

    • Dual Flat No-Leads

    • Quad Flat Package

    • Dual In-Line Package

    • Others

  • ITALY Semiconductor Packaging Material by End Use Industry

    • Consumer Electronics

    • Aerospace & Defense

    • Healthcare

    • Communication

    • Automotive

    • Others

  • SPAIN Outlook (USD Billion, 2018-2032)

  • Spain Semiconductor Packaging Material by Product Type

    • Substrates

    • Lead frames

    • Bonding Wires

    • Encapsulants

    • Underfill Materials

    • Die Attach

    • Solder Balls

    • Wafer Level Packaging Dielectrics

    • Others

  • Spain Semiconductor Packaging Material by Technology

    • Grid Array

    • Small Outline Package

    • Dual Flat No-Leads

    • Quad Flat Package

    • Dual In-Line Package

    • Others

  • Spain Semiconductor Packaging Material by End Use Industry

    • Consumer Electronics

    • Aerospace & Defense

    • Healthcare

    • Communication

    • Automotive

    • Others

  • Rest Of Europe Outlook (USD Billion, 2018-2032)

  • Rest Of Europe Semiconductor Packaging Material by Product Type

    • Substrates

    • Lead frames

    • Bonding Wires

    • Encapsulants

    • Underfill Materials

    • Die Attach

    • Solder Balls

    • Wafer Level Packaging Dielectrics

    • Others

  • Rest Of Europe Semiconductor Packaging Material by Technology

    • Grid Array

    • Small Outline Package

    • Dual Flat No-Leads

    • Quad Flat Package

    • Dual In-Line Package

    • Others

  • Rest Of Europe Semiconductor Packaging Material by End Use Industry

    • Consumer Electronics

    • Aerospace & Defense

    • Healthcare

    • Communication

    • Automotive

    • Others

• Asia-Pacific Outlook (USD Billion, 2018-2032)

  • Asia-Pacific Semiconductor Packaging Material by Product Type

    • Substrates

    • Lead frames

    • Bonding Wires

    • Encapsulants

    • Underfill Materials

    • Die Attach

    • Solder Balls

    • Wafer Level Packaging Dielectrics

    • Others

  • Asia-Pacific Semiconductor Packaging Material by Technology

    • Grid Array

    • Small Outline Package

    • Dual Flat No-Leads

    • Quad Flat Package

    • Dual In-Line Package

    • Others

  • Asia-Pacific Semiconductor Packaging Material by End Use Industry

    • Consumer Electronics

    • Aerospace & Defense

    • Healthcare

    • Communication

    • Automotive

    • Others

  • China Outlook (USD Billion, 2018-2032)

  • China Semiconductor Packaging Material by Product Type

    • Substrates

    • Lead frames

    • Bonding Wires

    • Encapsulants

    • Underfill Materials

    • Die Attach

    • Solder Balls

    • Wafer Level Packaging Dielectrics

    • Others

  • China Semiconductor Packaging Material by Technology

    • Grid Array

    • Small Outline Package

    • Dual Flat No-Leads

    • Quad Flat Package

    • Dual In-Line Package

    • Others

  • China Semiconductor Packaging Material by End Use Industry

    • Consumer Electronics

    • Aerospace & Defense

    • Healthcare

    • Communication

    • Automotive

    • Others

  • Japan Outlook (USD Billion, 2018-2032)

  • Japan Semiconductor Packaging Material by Product Type

    • Substrates

    • Lead frames

    • Bonding Wires

    • Encapsulants

    • Underfill Materials

    • Die Attach

    • Solder Balls

    • Wafer Level Packaging Dielectrics

    • Others

  • Japan Semiconductor Packaging Material by Technology

    • Grid Array

    • Small Outline Package

    • Dual Flat No-Leads

    • Quad Flat Package

    • Dual In-Line Package

    • Others

  • Japan Semiconductor Packaging Material by End Use Industry

    • Consumer Electronics

    • Aerospace & Defense

    • Healthcare

    • Communication

    • Automotive

    • Others

  • India Outlook (USD Billion, 2018-2032)

  • India Semiconductor Packaging Material by Product Type

    • Substrates

    • Lead frames

    • Bonding Wires

    • Encapsulants

    • Underfill Materials

    • Die Attach

    • Solder Balls

    • Wafer Level Packaging Dielectrics

    • Others

  • India Semiconductor Packaging Material by Technology

    • Grid Array

    • Small Outline Package

    • Dual Flat No-Leads

    • Quad Flat Package

    • Dual In-Line Package

    • Others

  • India Semiconductor Packaging Material by End Use Industry

    • Consumer Electronics

    • Aerospace & Defense

    • Healthcare

    • Communication

    • Automotive

    • Others

  • Australia Outlook (USD Billion, 2018-2032)

  • Australia Semiconductor Packaging Material by Product Type

    • Substrates

    • Lead frames

    • Bonding Wires

    • Encapsulants

    • Underfill Materials

    • Die Attach

    • Solder Balls

    • Wafer Level Packaging Dielectrics

    • Others

  • Australia Semiconductor Packaging Material by Technology

    • Grid Array

    • Small Outline Package

    • Dual Flat No-Leads

    • Quad Flat Package

    • Dual In-Line Package

    • Others

  • Australia Semiconductor Packaging Material by End Use Industry

    • Consumer Electronics

    • Aerospace & Defense

    • Healthcare

    • Communication

    • Automotive

    • Others

  • Rest of Asia-Pacific Outlook (USD Billion, 2018-2032)

  • Rest of Asia-Pacific Semiconductor Packaging Material by Product Type

    • Substrates

    • Lead frames

    • Bonding Wires

    • Encapsulants

    • Underfill Materials

    • Die Attach

    • Solder Balls

    • Wafer Level Packaging Dielectrics

    • Others

  • Rest of Asia-Pacific Semiconductor Packaging Material by Technology

    • Grid Array

    • Small Outline Package

    • Dual Flat No-Leads

    • Quad Flat Package

    • Dual In-Line Package

    • Others

  • Rest of Asia-Pacific Semiconductor Packaging Material by End Use Industry

    • Consumer Electronics

    • Aerospace & Defense

    • Healthcare

    • Communication

    • Automotive

    • Others

• Rest of the World Outlook (USD Billion, 2018-2032)

  • Rest of the World Semiconductor Packaging Material by Product Type

    • Substrates

    • Lead frames

    • Bonding Wires

    • Encapsulants

    • Underfill Materials

    • Die Attach

    • Solder Balls

    • Wafer Level Packaging Dielectrics

    • Others

  • Rest of the World Semiconductor Packaging Material by Technology

    • Grid Array

    • Small Outline Package

    • Dual Flat No-Leads

    • Quad Flat Package

    • Dual In-Line Package

    • Others

  • Rest of the World Semiconductor Packaging Material by End Use Industry

    • Consumer Electronics

    • Aerospace & Defense

    • Healthcare

    • Communication

    • Automotive

    • Others

  • Middle East Outlook (USD Billion, 2018-2032)

  • Middle East Semiconductor Packaging Material by Product Type

    • Substrates

    • Lead frames

    • Bonding Wires

    • Encapsulants

    • Underfill Materials

    • Die Attach

    • Solder Balls

    • Wafer Level Packaging Dielectrics

    • Others

  • Middle East Semiconductor Packaging Material by Technology

    • Grid Array

    • Small Outline Package

    • Dual Flat No-Leads

    • Quad Flat Package

    • Dual In-Line Package

    • Others

  • Middle East Semiconductor Packaging Material by End Use Industry

    • Consumer Electronics

    • Aerospace & Defense

    • Healthcare

    • Communication

    • Automotive

    • Others

  • Africa Outlook (USD Billion, 2018-2032)

  • Africa Semiconductor Packaging Material by Product Type

    • Substrates

    • Lead frames

    • Bonding Wires

    • Encapsulants

    • Underfill Materials

    • Die Attach

    • Solder Balls

    • Wafer Level Packaging Dielectrics

    • Others

  • Africa Semiconductor Packaging Material by Technology

    • Grid Array

    • Small Outline Package

    • Dual Flat No-Leads

    • Quad Flat Package

    • Dual In-Line Package

    • Others

  • Africa Semiconductor Packaging Material by End Use Industry

    • Consumer Electronics

    • Aerospace & Defense

    • Healthcare

    • Communication

    • Automotive

    • Others

  • Latin America Outlook (USD Billion, 2018-2032)

  • Latin America Semiconductor Packaging Material by Product Type

    • Substrates

    • Lead frames

    • Bonding Wires

    • Encapsulants

    • Underfill Materials

    • Die Attach

    • Solder Balls

    • Wafer Level Packaging Dielectrics

    • Others

  • Latin America Semiconductor Packaging Material by Technology

    • Grid Array

    • Small Outline Package

    • Dual Flat No-Leads

    • Quad Flat Package

    • Dual In-Line Package

    • Others

  • Latin America Semiconductor Packaging Material by End Use Industry

    • Consumer Electronics

    • Aerospace & Defense

    • Healthcare

    • Communication

    • Automotive

    • Others